Intel’s EMIB will allow Heterogeneous Silicon Chips to Talk & Work with each other

Time is changing for many, big companies are realizing that they need to work together to bring better things for the consumers. In a surprising move, two rival chip companies, Intel and AMD, are coming together to integrate Radeon Graphics with a Core CPU. This on a single chip.

Intel released this announcement detailing the fact Intel will produce a chip which will have the Intel CPU, and AMD’s graphics chip. The companies are putting best of their tech together which will make the lightweight notebooks powerful.

The interesting part of the announcement is that Intel isn’t just collaborating with AMD, instead, it’s laying out a path so more OEMs can come together. They think this will help in reducing the usual silicon footprint to less than half that of standard discrete components on a motherboard. This is something similar to what ARM and Qualcomm announced with Windows 10 on ARM.

Source: Intel YouTube

Intel says:

The new product, which will be part of our 8th Gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group* – all in a single processor package.

Scott Herkelman, vice president, and general manager, AMD Radeon Technologies Group, shared:

Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics.  Together we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible.

Intel is using a new design–EMIB–a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. This will make it possible for OEM’s to innovate, and still possible to talk to each other.